Composition comprising polyethylene and an ethylenically unsaturated aliphatic hydrocarbon of 20-35 carbon atoms and article thereof



United States Leon E. Wolinski, Buffalo, N.Y., assignor to E. I. do Point de Nemours and Company, Wilmington, Del., a corporation of Delaware No Drawing. Application June 20, 1956 Serial No. 592,502

8 Claims. (Cl. 260-33.6)

This invention relates to the manufacture of polyethylene structures and coatings. More particularly it relates to the preparation of polyethylene film suitable for conversion to bags, containers and similar packages.

One of the disadvantages of polyethylene film in the packaging field resides in its low adhesiveness to dried ink impressions, polymeric coatings, other substrates such as glass, wood, paper, and thermoplastic films other than polyethylene. The result is that any information imprinted on the surface of the polyethylene film such as instructions, advertising, trademarks or recipes are smeared or rubbed off by the normal abrasion sufiered by the film during handling. This shortcoming has been substantially overcome by so-called printability treatments described in US. Patents 2,502,841; 2,632,921; 2,648,097; 2,668,134; 2,715,075; 2,715,076; 2,715,077 and several patent applications disclosed hereinafter. However, these treatments in turn have caused another problem. The ability of polyethylene to adhere to itself by the application of pressure and heat, i.e. heat-scalability, necessary in converting the film to packages, although satisfactory prior to the printability treatment, falls below satisfactory levels after treatment.

The object of the present invention is to provide a polyethylene structure, particularly film, having improved properties. Another object is to improve the heat-sealability of polyethylene structures without sacrificing the desirable properties of the polyethylene structures. Another object is to provide polyethylene structures and polyethylene coatings having a high level of adhesiveness to printing inks and the like, that can be easily heatsealed. A more specific object is to provide a polyethylene composition, which when formed into a structure or used as a coating and subjected to a printability treatment, will provide a printable and heat-scalable structure. Other objects will appear hereinafter.

The objects are accomplished by a structure formed from a polyethylene resin having a weight average molecular weight of 15,000-3,000,000 (normally from 200,000 to 1,500,000) and containing a small amount, i.e. at least about 0.1% and preferably not more than about 10% based on the weight of the polyethylene resin, of at least one ethylenically unsaturated hydrocarbon, said hydrocarbon having a softening temperature no greater than the lower temperature of the crystalline melting point range of the polyethylene resin, preferably below 100 C., an average normal boiling point above the optical melting point of the polyethylene resin, preferably above 325 C., and a melt viscosity, at a temperature above 110 C., lower than that of the polyethylene resin.

Although it is possible to define a melting point for the monomeric hydrocarbon additives, the nature of the polymeric hydrocarbons makes it possible only to specify a softening temperature rather than a melting point. Since softening temperature is the more general term applying to both the monomeric and polymeric hydro- 2,924,584 Patented Feb. 9, 1960 sample leaves a molten trail when moved across the block by applying'light pressure with a spatula is the softening temperature.

In the case of a polyethylene resin, there is a narrow temperature range over which the crystallites melt. The crystalline melting point or the optical melting point, as observed through a polarizing microscope, is the temperature at which there is a disappearance of double refraction when a thin film of the sample is heated slowly through the melting range on a microheating stage.

The hydrocarbon is preferably blended uniformly into the polyethylene composition prior to extrusion. However, the hydrocarbon may be incorporated into the polyethylene resin at any stage during formation of the polyethylene structure or it may be added to the surface of the polyethylene structure after formation.

The aliphatic hydrocarbons suitable for this invention may be straight or branched aliphatic or cycle-aliphatic hydrocarbons. They may be monomeric or polymeric. They should preferably contain at least 8 carbon atoms in a straight chain and may contain more than one ethylenic linkage per molecule. In the following table are listed some unsaturated aliphatic hydrocarbons which fit the requirements of the present invention.

, Softening* Normal Bolling Compound Tertipeaagme Point C.)

l-nonene- 2-methyl-1-octei1 l-ripnene l-unde mam ass l-heamrl ammo below 100.

Llg-eimsadiene hexatriacontadiene above 325. tetratetracontadiene Do. l-cyclopentylbutene 2 157. 2-cyclohexylpropene 1 158. l-cyclohexylbutene-2.

177. Ucon DXL-l-ll Does not Distll.

Butarez" 15 b D Hydrop0l" TP v D "Hydropol V 4 Do. balata e 1 Do.

*Normal (at 760 mm. of mercury) softening and boiling points are given unless otherwise specified.

e A low molecular weight polyethylene manufactured by Union Carbide aud Carbon Chemical Corp.

b A low molecular weight polybutadiene manufactured by the Phillips Petroleum Company (molecular weight of 1500).

v A low molecular weight polybutadiene which has been reduced by hydrogen to an unsaturation level of 8% manufactured by Phillips Petroleum Company.

d A low molecular welght polybutadiene which has been reduced with hydrogen to an unsaturation level of 20% manufactured by Phillips Petroleum Company.

B A "trans form of natural rubber having a low molecular weight and containing unsaturation.

The preferred compounds are those containing from 20-35 carbon atoms in a straight chain, i.e. eicosene to pentatriacontenes. Polymeric aliphatic hydrocarbons containing ethylenic linkages and having a number average molecular weight between 1000 and 5000 are another preferred group of compounds. These latter compounds are derived from low molecular weight aliphatic unsaturatedhydrocarbons such as ethylene, propylene, butadiene, etc. and have softening temperatures below 100 C. while their normal boiling points are well above 325 C. Of the above compounds the following have proved most useful and hence are'particularly preferred: ll-tricosene, 17-pentatriacontene, and polybutadiene having a number average molecular weight of 1500.

This invention provides polyethylene structures which display a marked improvement in heat-scalability as shown by high heat-seal strength. Furthermore, the polyethylene structures are more readily heat-sealed to form seals of substantial strength at lower heat-sealing temperatures than used heretofore.

As mentioned previously, the most important application of this invention is to polyethylene structures, particularly film, whose surface adhesion has been improved by a so-called printability treatment. It is believed that this pn'ntability treatment roughens or modifies the surface of the polyethylene structureto create thereon microscopic hills not detectable by touch and not visible to the naked eye. A polyethylene film surface is considered to be satisfactorily roughened if the surface of the film contains substantially uniformly distributed hills or mounds, each individual hill or mound having a diameter, as measured parallel to the film surface, of at least 0.05 micron to 1 micron, and usually between 0.05 micron to 0.5 micron. The elevation or height of these hills or mounds relative to the flat areas, i.e., areas which appear to be relatively untreated, is seldom greater than 0.2-0.5 micron, and usually not greater than 0.25 micron. As a general rule, the printability treatments do not carve out areas of the film surface to form depressionstherein, but rather form bills or mounds having elevations relative to the untreated film surface. Besides improving printability (adhesion to printing inks), these treatments tend to improve the adhesive qualities of the'surface ofpolyethylene structures to organic coatings in general. However, as mentioned previously, these treatments reduce the ability of polyethylene to adhere to itself when pressure and heat are applied. V

For purposes of this invention, the adhesiveness of the surface of the polyethylene structure may be improved by any of a number of known expedients. These include superficial treatment of the polyethylene structure with chlorine gas described in US. Patent No. 2,502,481 to Henderson; treatment in a saturated solution of sodium dichrornate in concentrated sulfuric acid, in U.S. Patent No. 2,668,134 to Horton. US. Patent No. 2,632,921 to Kreidl, discloses a process of subjecting the surface of the polyethylene structure to a temperature above about 60 C. while maintaining the underlying parts of the structure at a temperature below about 50 C. Similarly, US. Patent No. 2,648,097 to Kritcheyer discloses exposing the'surface to a gas flame while. the opposite surface is supported on a cool drum. Other techniques involve treating the surface with ozone while maintaining the structure at temperatures above 150 C.; that is, the molten structure immediately after extrusion (in the air gap) may be treated with a gas containing ozone. This process is described and claimed in a copending application, U.S. Serial No. 323,271, filed November 29, 1952, by L. E. Wolinski. L. E. Wolinski has other patents and applications that involve treatment with ozone: US. Patent No. 2,715,075 relates to treat ment in the presence of ozone and a halogen or hydrogen halide; US. Patent No. 2,715,076 relates to treatment with ozone in the presence of nitrous oxide; U.S. Serial No. 323,274 filed November 29, 1952, now US. Patent No. 2,805,960, relates to treatment with ozone at a temperature of at least 150 C. followed by quenching the structure in an aqueous solution containing a halogen or halogen .acid; and US. Serial No. 323,275, filed November 29, 1952, now US. Patent No. 2,801,446, re-

lates to treatment with ozone at a temperature of at least 150 C. followed by quenching the structure in a bath containing a conditioning agent such as hydrogen peroxide, nitrous acid, alkaline hypochlorites, concentrated nitric acid or mixtures of-concentrated nitric acid and concentrated sulphuric acid. Treating the molten polyethylene structure, maintained at a temperature above 150 C., with nitrous oxideis described in U.S. Patent 2,715,077 to L. E. Wolinski. The adhesiveness of the surface of polyethylene may also be improved by quenching a freshly extruded film in an aqueous bath containing a halogen or a halogen acid as described in copending application U.S. Serial No. 347,391,. filed; April 7, 1953, now US. Patent No. 2,801,447, by L. E. Wolinski. The polyethylene structure may be heated with a special conditioning agent such as hydrogen peroxide, concentrated nitric acid, nitrous acid, alkaline hypochlorites, or mixtures of concentrated nitric acid and concentrated sulphuric acid, as described in copending application US. Serial 'No. 487,701, filed February 11, 1955, now US. Patent No. 2,878,519, by L. E. Wolinski. The use of high voltage stress accompanied by corona discharge, as

disclosed in British Patent Nos. 715,914 and 722,875,

may also be used. Surfaces of relatively high-density polyethylene structures may be made more adhesive by quenching a freshly formed structure after extruding at a temperature of at least 325 C. as described in US. Serial No. 506,660 filed May 6, 1955 by I. Swerliek.

Specific embodiments of the present invention are presented in the following examples, Example 2 representing the best mode contemplated for performing the invention. In all the examples except examples in Table VI, Bakelite DYNH-3 1 polyethylene resin flake was used. This. particular resinhas its lower temperature of the crystalline meltingpoint range at about C., an optical melting point of 109 C., a density of about 0.92 gram/cc. and a weight average molecular weight of 750,000- 1,000,000. 7

EXAMPLES 1-12 A mixture of polyethylene resin flake and a percentage as given in Table I, based on the weight of the resin, of

the additives was melt blended in a Banbury mixer at a and extruded at 285 C. in the form of a film through a six inch air. gap into a water quench bath maintained at about 30 C.

During its passage through the air gap, the'molten polyethylene film underwent a printability treatment. The air gap was enclosed by a treating chamber. An ozone/ oxygen mixture, containing about 1.2% ozone by volume, was passed through the chamber to contact one surface of the polyethylene film as described in US. Serial No. 323,271. The ozone/oxygen mixture passed through the chamber at rates of 0.49 cu.ft./min., 0.83 cu. ft./min., and 1.66 cu.ft./min. while the polyethylene film was led through the chamber at about 22 ft./min.

The properties of the resulting films, compared to 'a control film, are given in the following table. Heat-seal strength was measured in the following manner. The film samples were first cut into 6 squares. Squares from the same sample were then superimposed and sealed along one edge with a steel bar 3 /2" long and wide at a temperature of 200 C. The seals were performed by using a dwell time of 0.15 second and a pressure of 10 lbs./sq.in. The heat-seals were made by sealing a surface that had undergone a printab ility treatment to a surface that had not, in a direction transverse to the direction. in which the film was extruded. After heatsealing, the connected squares were cut into strips 3" long littanufaetured by Union Carbide and Carbon Corp.

then pulled apart in a tensile testing apparatus at a rate of 100% per minute. The strength of the heat-seal, expressed in grams/in. of width represents the highest force necessary to pull the strips apart.

Printability was determined by applying Excelobrite W-500, an ink manufactured by Bensing Brothers & Deeney, to the surface of the film by a commercial ink spreader. The spreader was composed of a steel rod having fine wires wrapped around it and produced a plurality of fine white lines on the surface of the film. The ink was dried by exposure for 3 minutes to a temperature of 60 C. After the ink cooled to room temperature, a strip of pressure-sensitive tape was applied to the film surface and pressed firmly. The strip was then pulled from the surface of the film and examined to determine whether any ink was removed. If ink were removed, the structure was classified as non-printable.

Table I.-Efiect of additives on heat-seal strengths of printable polyethylene film Heat-Seal Strength (grams/ inch) at Ozone/Oxygen Rate Example Percent Additive 0.49 0.83 1.66 Cubic Cubic Cubic FtJMin. Ft./Mi.n. Ft./Min.

Control None 1, 000 1, 040 1 0.1% ll-tricosene 1, 250 1,275 2 0.4% ll-tricosene 1, 345 1, 330 .8% ll-tricosene 1, 375 1, 290 4 0% ll-tricosene 1, 430 1, 320 .4% 17-pentatriacontene 1, 625 1, 570 .8% 17-pentatriacontene- .0% l7-pentatriacontene 1, 305

0.2% Butarez 1, 220 r 0.4% Butarez 1, 180 2.0% Butarcz 5.0% Hydropol V 1,205 5.0% Hydropol TP 1, 655

EXAMPLES 13-16 In these examples printable polyethylene films, all but one containing additives in accordance with the present invention, were prepared in the manner described for Examples 1-12. To obtain printability, the ozone/oxygen mixture was passed through the treating chamber at a rate of 0.83 unit/min. Heat-seal strengths .were measured as in the previous examples except for the use of different'sealing temperatures as disclosed in .Table II.

Table II.-Heat-sealability of printable polyethylene film Heat-Seal Strength (grams/in.) Using Heat-Seal Temperatures Example .Percent Additive of 150 0., 160 0., 180 0.,

and 200 0.

None 200 270 570 800 0.8% ll-tricosene. 720 805 1, 050 1, 200 2.0% ll-tricosene 670 710 1,020 l, 220 0.8% 17-pentatriac0ntene. 580 760 1, 025 1,180 1.0% l7-pentatriacontene. 606 740 1, 034 1, 193

EXAMPLES 17-23 Blends of polyethylene resin and the additives were prepared and melt extruded in the form of films as described for Examples 112. The extruded films passed through a 6 inch air gap into a water quench at 30 C. with no oxygen/ozone treatment in the air gap. Instead, printability was obtained by conducting the film from the water quench over a grounded steel drum rotating at a circumferential speed of 35 ft./minute. A Tesla coil was held A3 above the drum and discharged 30,000 volts across the width of the polyethylene film in a manner similar to that described in British Patent No. 715,914.

The properties of the resulting printable films com- 6 pared to a control film that. contained no additive but received the electrical discharge treatment, are given in the following table. Heat-seal strength was measured by sealing at the temperatures indicated in the table.

Table Ill.-Heat-seal strength of printable polyethylene Heat-Seal Strength (grams/in.) Using Heat-Seal Tempera- Example Percent Additive tures of 160 C. and

None 425 925 0. 760 1, 250 0.4% 960 1, 263 0.6% ll-tricosene 750 1, 235 0.1% 17-pentatriac0nte 774 1, 238 0.87 17-pentatriaeontene 914 1, 248

0. a "Butarez" 15. 824 1, 270 0.4% Butarez 15". 834 1, 243

EXAMPLES 24-25 Blends of polyethylene resin and the additives were prepared and melt extruded in the form of films as described for Examples 1-12. The extruded films passed through a 6 inch air gap into a water quench at 30 C. with no ozone/oxygen treatment in the air gap. Instead, printability was obtained by treating the film at a speed of 100 ft./min. with a propane/air flame at a flame temperature of about 1900 C., the burner being about from the surface of. the film. The top surface of the film attained a temperature over 200 C. while the under surface passed over a chromium roll maintained at 2 C. The details of this printability treatment are given in US. Patent No. 2,648,097.

The properties of the resulting printable films, compared to a control film that contained no additive but received the flame treatment, aregiven in the following table.

Table IV.-Heat-seal strength of printable polyethylene Polyethylene film was prepared as described for Examples 1-12 from a blend of resins containing 50% by weight Bakelite DYNH-3 and 50% Alathon 14 1 omitting the additives and the ozone/oxygen treatment. The blended resin had a density of 0.917 gram/cc, a Weight average molecular weight of between 750,000 and 1,000,000 and a crystalline melting point range from about 95 C. to an optical melting point of 108 C.

The additives were either dissolved in benzene or dispersed in water as indicated in the table and applied to the film by dipping the film into the solution or dispersion. The coated film was dried in a circulating air oven at about 60 C. Thereafter, the film was subjected to the electrical discharge treatment as described for Examples 17-23 or the flame treatment as described for Examples 2425, as indicated in the table.

The results are presented in the following table.

I Manutactured by E. I. du Pont de Nemours & Company,

Table V.--Heat-seal strength of printable polyethylene EXAMPLES 32-37 A polyethylene marinas prepared in the manner 'described for Examples 1-12. omittingthe ozone/oxygen treatment, The results for. these non-printable films are given in the followingtable. The heat-seal strengths of two commercial ipolyethylenefilms (productsX and Y), containing no additives of the type disclosed herein, are also given for comparative purposes.

Table VI.Heat-'seal strength of non-printable polyethylene film Heat-Seal Strength (grams/ inch) Using Heat-Seal Temperatures of 120 0., 145 0., Example Percent Additive and 160 0.

Control None No seal 300 Product X o. Product Y do--. 32 0.2% lI-tracosene I 33 0. u arez" a4 0.473 UOON DXL-l- 53s I 1,- 168 11. 1.0% fBalata', 792 338 5.0% Hydr'opol V..- 746 1, 128 5.0% Hydropol" TIP. 908 l, 118

As shown by the examples, the invention is not only useful in preparing heat-scalable, printable polyethylene packaging film, but is useful 'inimproving the'heat-seal strength of polyethylene film in general, and in lowering the temperaturerequired for satisfactory heat-seals. In

the case'of printable polyethylene packaging films, the addition of the unsaturated aliphatic hydrocarbons, in accordance with the invention serves to recover the heatseal strength lost by the'polyeth'ylene film due to the printability treatment. The use of these special additives also tends to retard the loss of printability and heatscalability of the polyethylene film with age such as inevitably occurs during storage'prior to printing and conversion of 'film to bags. I

Besides polyethylene'film, the invention is applicable toother self-supporting structures such as filaments, rods, "tubes, sheets for lamination and to supported polyethylene structures'wherein polyethylene compositions containing the additives are coated -on-one or both sides of various base films such as-cellophane, polyethylene terephthalate, polyvinylidene chloride, etc. It is applicable to polyethylene structures of normal density (0.91-0.93 gram/ cc.) and to polyethylene structures of heavy density (0.940.96 gram/cc); to polyethylene compositions formed by copolymerizing polyethylene with minor amounts of propylene, butylene, isobutylene, styrene, vinyl-acetate and similar vinylcompounds; to polymethylene derived from carbon monoxide and hydrogen as in- US. PatentNo."2,6 52;372 to Farlow and Herrick; and to polypropylene, polybutylene and the like.

In fonningwpolyethylen'e films either containing the Special additives or to which the additive is later applied; a melt extrusion process is usually employed. In general, a molding powder or flake of polyethylene is fed continuously into a meltextrusion machine; themolten polyethylene is continuously extruded through a 's'loto'rifice, then through anpair gap vertically downward into a quench bath. or onto a quench roll maintained at a temperature from 25 C.- 0, preferably from 30 C.-60 C. Usually, the polyethylene is extruded from a melt maintained at a temperature above C. Tubing is usuallyextruded from a melt at a temperature within arrange of 150 C.200 C., whereasfilm is extruded at a temperature which may lie anywhere from above 250 C. to the degradation temperature of the polyethylene. An alternate process of forming polyethylene film which also employs molten polyethylene comprises 'millingmolten polymer on closely spaced calender rolls-to form a film which is conducted vertically downward into a quench bath. In either of these general methods of forming polyethylene film, the space between the point where the molten film leaves the slot orifice or the last calendar roll and the point where the molten film enters the quench bath is termed the air gap. Duringpassage through the air gap, the film is usually permitted to pass uninhibited through the atmosphere; and this provides for some superficial cooling. Generally, the length of the air gap ranges from 2" to as long as 15 in. some cases. In some cases as illustrated. in

Examples 116, the film may be subjected tothe print;-

thereof in a solvent, or from dispersions of the poly.-

ethylene in an inert liquid medium such as water. Similarly, the polyethylene coatings may be applied upon other substrates from a melt, solvent solution or dispersion in a liquid medium.

The amount of additive required lies above about 0.1%, and very rarely above 10%. The precise amount will depend upon the increase in heat-seal strength desired. In cases where it is desired to recover the heatseal strength lost by theprintability treatment, the amount of additive will depend on the particular printability treatment and the extent of this treatment. In most cases, not more than about 5% of the additive need be incorporated in or applied to the surface of the polyethylene film to recover the heat-seal strength lost due to the printability treatment. In any case, the unsaturated aliphatic hydrocarbons should be added to the polyethylene structure or polyethylene coating composition prior to any printability treatment.

The following theory is ofiered to explain the surprising success of the preesnt invention. However, this theory should not be construed as limiting the scope of the invention. It is believed that the additive when incorporated in the polyethylene composition is not completely compatible with the polyethylene resin. During the heat-sealing step, the additive tends to exude to the surface, thus plasticizing the surface of the polyethylene structure. If added to the surface, the additive also serves to plasticize the surface during the heat-sealing step. Plasticization of the surface, in turn, serves to increase the heat-scalability of the structure.

As many widely different emtbodiments can be made without departing from the spirit and scope of this invention, this invention is not limited except as defined in the appended claims.

What is claimed is:

l. A composition of matter comprising a polyethylene resin having a weight average molecular weight of 15,000 to 3,000,000 and 01-10%, based on the weight of said resin, of at least one ethylenically unsaturated aliphatic hydrocarbon containing from 20-35 carbon atoms.

2. A composition of matter as in claimlwherein the 9 ethylenically unsaturated aliphatic hydrocarbon is 11-tricosene.

3. A composition of matter as in claim 1 wherein the ethylenically unsaturated aliphatic hydrocarbon is 17- pentatriacontene.

4. A composition of matter as in claim 1 in the form of a self-supporting structure.

5. A composition of matter as in claim 1 in the form of a packaging film.

6. A composition of matter comprising a polyethylene resin having a weight average molecular weight 200,000 to 1,500,000 and .1-10%, based on the Weight of said resin, of at least one ethylenically unsaturated aliphatic hydrocarbon containing from 20-35 carbon atoms.

7. A composition of matter as in claim 6 in the fdrm of a packaging film.

8. A composition of matter as in claim 6 in the form of a self-supporting structure.

References Cited in the file of this patent UNITED STATES PATENTS Peters Aug. 20, 1946 Fuller Feb. 15, 1949 DAlelio Nov. 28, 1950 Clarke Oct. 28, 1952 Bright Mar. 17, 1953 Field et a1. Oct. 12, 1954 Bruson Jan. 18, 1955 

1. A COMPOSITION OF MATTER COMPRISING A POLYETHYLENE RESIN HAVING A WEIGHT AVERAGE MOLECULAR WEIGHT OF 15,000 TO 3,000,000 AND 0.1-10%, BASED ON THE WEIGHT OF SAID RESIN, OF AT LEAST ONE ETHYLENICALLY UNSATURATED ALIPHATIC HYDROCARBON CONTAINING FROM 20-35 CARBON ATOMS. 